Copper sulfate CuSO4 exhibits both ionic and covalent bonding. The bonding between the copper Cu cation and the sulfate SO4 anion is ionic, while the bonding within the sulfate anion itself is covalent.Ionic bonding occurs between a metal and a non-metal, where electrons are transferred from the metal to the non-metal. In CuSO4, copper Cu is a metal that loses two electrons to form a Cu2+ cation, while the sulfate SO4 is a polyatomic anion formed by the combination of sulfur S and oxygen O atoms. The electrostatic attraction between the Cu2+ cation and the SO4^2- anion results in the ionic bond.Covalent bonding, on the other hand, occurs between non-metals, where electrons are shared between the atoms. Within the sulfate anion SO4^2- , sulfur S is covalently bonded to four oxygen O atoms through the sharing of electrons. This forms a tetrahedral structure with covalent bonds between the sulfur and oxygen atoms.In summary, copper sulfate CuSO4 exhibits both ionic bonding between the Cu2+ cation and the SO4^2- anion and covalent bonding within the sulfate anion itself .